Enriched Boron Trifluoride-11(¹¹BF₃) With ¹¹B enrichment ≥99.9% And Purity ≥99.999% Cas No.20654-88-0

Enriched Boron Trifluoride-11(¹¹BF₃) With ¹¹B enrichment ≥99.9% And Purity ≥99.999% Cas No.20654-88-0

¹¹BF₃ ranks among the most critical p-type dopant gases for semiconductor ion implantation. Owing to ¹¹B’s near-zero neutron absorption, it enables precise doping control during implantation, boosting the conductivity and radiation tolerance of semiconductor components. Key impurity specifications: ¹¹B enrichment ≥99.9%, purity ≥99.999%, N₂ ≤15 ppmv, O₂/Ar ≤15 ppmv, CO₂ ≤15 ppmv, SO₂ ≤15 ppmv, HF ≤15 ppmv, SiF₄ ≤15 ppmv.

BoronHub’s ¹¹BF₃ is filled into high-purity steel cylinders with customizable purity and enrichment grades. All production equipment is fully domestically manufactured, delivering independent proprietary technology and a stable, secure supply chain.

Corporate Specifications of Enriched Boron Trifluoride-11 (¹¹BF₃)

¹¹B isotopic abundance: ≥99.9% Purity: ≥99.999%

Impurity limits (Unit: ppmv): N₂ ≤15, O₂/ Ar ≤15, CO₂ ≤15, SO₂ ≤15, HF ≤15, SiF₄ ≤15

Packaging

Supplied in steel cylinders (Contact our sales representative for detailed cylinder specifications and packaging information).

Note: Customization of purity, isotopic abundance and packaging specifications is available upon request.

What are the Application Sectors of Enriched Boron Trifluoride-11(¹¹BF₃)?

*Semiconductor Manufacturing: Core electronic specialty gas for high-end chips, display panels and other semiconductor products

 

*Photovoltaic Industry: Doping processes for solar cell production

 

*Chemical & Advanced Materials: Synthesis of diborane, boron trichloride and other chemical raw materials, plus optical fiber preform fabrication

 

What are the Detailed Functions of Enriched Boron Trifluoride-11(¹¹BF₃)?

P-Type Dopant for Ion Implantation

As the most vital p-type doping gas for semiconductor ion implantation, it is adopted for manufacturing advanced-node chips below 3 nm. It effectively suppresses memory bit flipping and significantly boosts chips’ radiation resistance and operational reliability.

Diffusion & Oxidation Processes

It is applied across multiple semiconductor manufacturing stages, including doping, oxidation diffusion, plasma etching, and silicon/germanium epitaxial growth.

 

Improved Chip Yield & Performance

High-enrichment, high-purity ¹¹BF₃ is an irreplaceable specialty gas for high-end chip fabrication. Its isotopic abundance and chemical purity directly determine wafer yield and finished chip performance.

Etching Processes

Ultra-pure ¹¹BF₃ enhances etching selectivity and process uniformity.